Mechanical properties and microstructure of Ca-doped gold bonding wire
Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TE...
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| creator | Sritharan, S.T. Breach, C.D. Wulff, F. Mhaisalkar, S.G. |
| description | Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed. |
| doi_str_mv | 10.1109/EPTC.2003.1271585 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1271585</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1271585</ieee_id><sourcerecordid>1271585</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-c21f37a6d2c7a0fc916861bfa2cec539438f5ef0d76141790a0b669dc39365c63</originalsourceid><addsrcrecordid>eNotj0FLxDAUhAMiKGt_gHjJH2h9L9kkzVHKrgoreljPS5q8rJFuW9Iu4r-34A4Dc_kYZhi7R6gQwT5uPvZNJQBkhcKgqtUVK6ypYbGsBSh5w4pp-oZF0q61lrds-0b-y_XJu46PeRgpz4km7vrAT8nnYZrz2c_nTHyIvHFlWJDAj0MXeDv0IfVH_pMy3bHr6LqJikuu2Od2s29eyt3782vztCsTGjWXXmCUxukgvHEQvUVda2yjE568WjbJOiqKEIzGNRoLDlqtbfDSSq28liv28N-biOgw5nRy-fdweSv_ALS1SnA</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Mechanical properties and microstructure of Ca-doped gold bonding wire</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Sritharan, S.T. ; Breach, C.D. ; Wulff, F. ; Mhaisalkar, S.G.</creator><creatorcontrib>Sritharan, S.T. ; Breach, C.D. ; Wulff, F. ; Mhaisalkar, S.G.</creatorcontrib><description>Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.</description><identifier>ISBN: 9780780382053</identifier><identifier>ISBN: 0780382056</identifier><identifier>DOI: 10.1109/EPTC.2003.1271585</identifier><language>eng</language><publisher>IEEE</publisher><subject>Alloying ; Bonding ; Gold ; Grain size ; Integrated circuit interconnections ; Integrated circuit packaging ; Manufacturing processes ; Mechanical factors ; Microstructure ; Wire</subject><ispartof>Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), 2003, p.569-573</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1271585$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1271585$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Sritharan, S.T.</creatorcontrib><creatorcontrib>Breach, C.D.</creatorcontrib><creatorcontrib>Wulff, F.</creatorcontrib><creatorcontrib>Mhaisalkar, S.G.</creatorcontrib><title>Mechanical properties and microstructure of Ca-doped gold bonding wire</title><title>Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)</title><addtitle>EPTC</addtitle><description>Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.</description><subject>Alloying</subject><subject>Bonding</subject><subject>Gold</subject><subject>Grain size</subject><subject>Integrated circuit interconnections</subject><subject>Integrated circuit packaging</subject><subject>Manufacturing processes</subject><subject>Mechanical factors</subject><subject>Microstructure</subject><subject>Wire</subject><isbn>9780780382053</isbn><isbn>0780382056</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj0FLxDAUhAMiKGt_gHjJH2h9L9kkzVHKrgoreljPS5q8rJFuW9Iu4r-34A4Dc_kYZhi7R6gQwT5uPvZNJQBkhcKgqtUVK6ypYbGsBSh5w4pp-oZF0q61lrds-0b-y_XJu46PeRgpz4km7vrAT8nnYZrz2c_nTHyIvHFlWJDAj0MXeDv0IfVH_pMy3bHr6LqJikuu2Od2s29eyt3782vztCsTGjWXXmCUxukgvHEQvUVda2yjE568WjbJOiqKEIzGNRoLDlqtbfDSSq28liv28N-biOgw5nRy-fdweSv_ALS1SnA</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Sritharan, S.T.</creator><creator>Breach, C.D.</creator><creator>Wulff, F.</creator><creator>Mhaisalkar, S.G.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2003</creationdate><title>Mechanical properties and microstructure of Ca-doped gold bonding wire</title><author>Sritharan, S.T. ; Breach, C.D. ; Wulff, F. ; Mhaisalkar, S.G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-c21f37a6d2c7a0fc916861bfa2cec539438f5ef0d76141790a0b669dc39365c63</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Alloying</topic><topic>Bonding</topic><topic>Gold</topic><topic>Grain size</topic><topic>Integrated circuit interconnections</topic><topic>Integrated circuit packaging</topic><topic>Manufacturing processes</topic><topic>Mechanical factors</topic><topic>Microstructure</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Sritharan, S.T.</creatorcontrib><creatorcontrib>Breach, C.D.</creatorcontrib><creatorcontrib>Wulff, F.</creatorcontrib><creatorcontrib>Mhaisalkar, S.G.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sritharan, S.T.</au><au>Breach, C.D.</au><au>Wulff, F.</au><au>Mhaisalkar, S.G.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Mechanical properties and microstructure of Ca-doped gold bonding wire</atitle><btitle>Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)</btitle><stitle>EPTC</stitle><date>2003</date><risdate>2003</risdate><spage>569</spage><epage>573</epage><pages>569-573</pages><isbn>9780780382053</isbn><isbn>0780382056</isbn><abstract>Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2003.1271585</doi><tpages>5</tpages></addata></record> |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Alloying Bonding Gold Grain size Integrated circuit interconnections Integrated circuit packaging Manufacturing processes Mechanical factors Microstructure Wire |
| title | Mechanical properties and microstructure of Ca-doped gold bonding wire |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T22%3A28%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Mechanical%20properties%20and%20microstructure%20of%20Ca-doped%20gold%20bonding%20wire&rft.btitle=Proceedings%20of%20the%205th%20Electronics%20Packaging%20Technology%20Conference%20(EPTC%202003)&rft.au=Sritharan,%20S.T.&rft.date=2003&rft.spage=569&rft.epage=573&rft.pages=569-573&rft.isbn=9780780382053&rft.isbn_list=0780382056&rft_id=info:doi/10.1109/EPTC.2003.1271585&rft_dat=%3Cieee_6IE%3E1271585%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1271585&rfr_iscdi=true |