Mechanical properties and microstructure of Ca-doped gold bonding wire

Mechanical properties and microstructure of Ca-doped gold bonding wire

Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TE...

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Hauptverfasser: Sritharan, S.T., Breach, C.D., Wulff, F., Mhaisalkar, S.G.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Alloying
Bonding
Gold
Grain size
Integrated circuit interconnections
Integrated circuit packaging
Manufacturing processes
Mechanical factors
Microstructure
Wire
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Beschreibung
Zusammenfassung:Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.
DOI:10.1109/EPTC.2003.1271585