Package-silicon co-design-experiment with an SOC design

In this paper, we describe a package-silicon co-design approach attempted for an RF integrated SOC design. Extensive simulations were carried out to determine the sensitivity of different package layout parameters on signal integrity and noise related issues. These experiments helped in influencing...

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Hauptverfasser:	Suresh, P.R., Sundararajan, P.K., Goel, A., Udayakumar, H., Srinivasan, C., Sinari, V., Ravinutala, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Crosstalk Degradation Design optimization Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Geometry Integrated circuits Packaging Performance analysis Radio frequency Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Signal analysis Silicon Switches
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