Characterization of boron and phosphorus surface contamination in high current ion implantation

Both implant equipment vendors and semiconductor manufacturers expend significant resources to reduce cross-species surface contamination. Equipment vendors continually refine their implanter designs to this end, while chipmakers may utilize in situ processes to sputter-clean beamline and process ch...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bernstein, J.D., Alvarez, A.W., Benton, E.B., Cherukuri, K.C., Otten, C.M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Boron Implants Ion beams Ion implantation Plasma devices Plasma immersion ion implantation Refining Semiconductor device manufacture Surface cleaning Surface contamination
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