Some aspects of substrates microconfiguration for MCMs applications using laser technologies
The paper presents some experiments of using laser technology in microconfiguration for MCMs applications in MST domain. The experiments were performed on silicon and silicon/dielectric/metallic thin films. We obtain results both for surface (nets) and bulk (hole trough substrate) and established pr...
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| creator | Cernica, I. Manea, E. Ulieru, D. Gavrilescu, D. |
| description | The paper presents some experiments of using laser technology in microconfiguration for MCMs applications in MST domain. The experiments were performed on silicon and silicon/dielectric/metallic thin films. We obtain results both for surface (nets) and bulk (hole trough substrate) and established process programs. Further experiments will be necessary in order to optimize the roughness and the geometry control for bulk micoconfiguration. |
| doi_str_mv | 10.1109/SMICND.2003.1251369 |
| format | Conference Proceeding |
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Further experiments will be necessary in order to optimize the roughness and the geometry control for bulk micoconfiguration.</description><subject>Dielectric substrates</subject><subject>Dielectric thin films</subject><subject>Geometry</subject><subject>Laser ablation</subject><subject>Laser applications</subject><subject>Laser beam cutting</subject><subject>Mirrors</subject><subject>Paper technology</subject><subject>Rough surfaces</subject><subject>Silicon</subject><isbn>9780780378216</isbn><isbn>0780378210</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkMtKxDAYhQMiKGOfYDZ5gdakaW5LqbeBqS5Gd8KQpn9rpG1K_87Ct7c4c_jgwLc4i0PIlrOMc2bvD9WufHvMcsZExnPJhbJXJLHasBWhTc7VDUkQf9iaQhYyl7fk6xAHoA4n8AvS2FI81bjMbgGkQ_Bz9HFsQ3daTYgjbeNMq7JC6qapD_5fIj1hGDvaO4SZLuC_x9jHLgDekevW9QjJpTfk8_npo3xN9-8vu_Jhnwau5ZK6xtUmr41UEgyXWjdGFo1VGqBWRuWtAqm9VQDWCKUkY9x7B6IQjXdNo8WGbM-7AQCO0xwGN_8eLx-IP9-0VJI</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Cernica, I.</creator><creator>Manea, E.</creator><creator>Ulieru, D.</creator><creator>Gavrilescu, D.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2003</creationdate><title>Some aspects of substrates microconfiguration for MCMs applications using laser technologies</title><author>Cernica, I. ; Manea, E. ; Ulieru, D. ; Gavrilescu, D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-adab82b8565e81577d854d967eeb6862f6e57c96ee983665001ccae343dcadd73</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Dielectric substrates</topic><topic>Dielectric thin films</topic><topic>Geometry</topic><topic>Laser ablation</topic><topic>Laser applications</topic><topic>Laser beam cutting</topic><topic>Mirrors</topic><topic>Paper technology</topic><topic>Rough surfaces</topic><topic>Silicon</topic><toplevel>online_resources</toplevel><creatorcontrib>Cernica, I.</creatorcontrib><creatorcontrib>Manea, E.</creatorcontrib><creatorcontrib>Ulieru, D.</creatorcontrib><creatorcontrib>Gavrilescu, D.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Cernica, I.</au><au>Manea, E.</au><au>Ulieru, D.</au><au>Gavrilescu, D.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Some aspects of substrates microconfiguration for MCMs applications using laser technologies</atitle><btitle>2003 International Semiconductor Conference. 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| ispartof | 2003 International Semiconductor Conference. CAS 2003 Proceedings (IEEE Cat. No.03TH8676), 2003, Vol.1, p.163-166 Vol. 1 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Dielectric substrates Dielectric thin films Geometry Laser ablation Laser applications Laser beam cutting Mirrors Paper technology Rough surfaces Silicon |
| title | Some aspects of substrates microconfiguration for MCMs applications using laser technologies |
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