Some aspects of substrates microconfiguration for MCMs applications using laser technologies

Some aspects of substrates microconfiguration for MCMs applications using laser technologies

The paper presents some experiments of using laser technology in microconfiguration for MCMs applications in MST domain. The experiments were performed on silicon and silicon/dielectric/metallic thin films. We obtain results both for surface (nets) and bulk (hole trough substrate) and established pr...

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Bibliographische Detailangaben
Hauptverfasser: Cernica, I., Manea, E., Ulieru, D., Gavrilescu, D.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Dielectric substrates
Dielectric thin films
Geometry
Laser ablation
Laser applications
Laser beam cutting
Mirrors
Paper technology
Rough surfaces
Silicon
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Beschreibung
Zusammenfassung:The paper presents some experiments of using laser technology in microconfiguration for MCMs applications in MST domain. The experiments were performed on silicon and silicon/dielectric/metallic thin films. We obtain results both for surface (nets) and bulk (hole trough substrate) and established process programs. Further experiments will be necessary in order to optimize the roughness and the geometry control for bulk micoconfiguration.
DOI:10.1109/SMICND.2003.1251369