Localization of electrical failures from the backside of the die: Failure Analysis case studies using infrared emission microscope

We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.

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Bibliographische Detailangaben
Hauptverfasser:	Bailon, M.F., Tarun, A.B., Nery, M., Munoz, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Atomic force microscopy Circuit faults Computer aided software engineering Electron emission Failure analysis Integrated circuit interconnections Optical microscopy Scanning electron microscopy Transistors Transmission electron microscopy
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Beschreibung
Zusammenfassung:	We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.
DOI:	10.1109/IPFA.2003.1222764