Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array
In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 102 |
|---|---|
| container_issue | |
| container_start_page | 97 |
| container_title | |
| container_volume | |
| creator | Kam Meng Chong Hang Keang Lim Chin Seng Ong |
| description | In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength. |
| doi_str_mv | 10.1109/IPFA.2003.1222746 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1222746</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1222746</ieee_id><sourcerecordid>1222746</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-724cf86d54ad74ce0c22ed2550896b4dfec4bef4f48b0c62022c7dc303e0ce583</originalsourceid><addsrcrecordid>eNo9UMtKxDAUDYigjP0AcZMfaL29SZt0OQxWBwZ0MVsZ0jymkfRBWpH-vRWHuRzOWZzH4hLymEOW51A97z_qbYYALMsRUfDyhiSVkLCCCYFY3pFkmr5gPVYVUsI9-ayDH6luV5p88HroqYtKz9_R0s7qVvV-6uiPn1vK0nHw_Uwb25vVm-MQhvNC_xrXjUaFQM_RG6piVMsDuXUqTDa56IYc65fj7i09vL_ud9tD6iuYU4FcO1magisjuLagEa3BogBZlQ03zmreWMcdlw3oEgFRC6MZsDVqC8k25Ol_1ltrT2P0nYrL6fID9gtawVLU</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Kam Meng Chong ; Hang Keang Lim ; Chin Seng Ong</creator><creatorcontrib>Kam Meng Chong ; Hang Keang Lim ; Chin Seng Ong</creatorcontrib><description>In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.</description><identifier>ISBN: 9780780377226</identifier><identifier>ISBN: 0780377222</identifier><identifier>DOI: 10.1109/IPFA.2003.1222746</identifier><language>eng</language><publisher>IEEE</publisher><subject>Assembly ; Electronics packaging ; Encapsulation ; Equations ; Fixtures ; Flip chip ; Metrology ; Silicon ; Tensile stress ; Thermal stresses</subject><ispartof>Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003, 2003, p.97-102</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1222746$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1222746$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kam Meng Chong</creatorcontrib><creatorcontrib>Hang Keang Lim</creatorcontrib><creatorcontrib>Chin Seng Ong</creatorcontrib><title>Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array</title><title>Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003</title><addtitle>IPFA</addtitle><description>In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.</description><subject>Assembly</subject><subject>Electronics packaging</subject><subject>Encapsulation</subject><subject>Equations</subject><subject>Fixtures</subject><subject>Flip chip</subject><subject>Metrology</subject><subject>Silicon</subject><subject>Tensile stress</subject><subject>Thermal stresses</subject><isbn>9780780377226</isbn><isbn>0780377222</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9UMtKxDAUDYigjP0AcZMfaL29SZt0OQxWBwZ0MVsZ0jymkfRBWpH-vRWHuRzOWZzH4hLymEOW51A97z_qbYYALMsRUfDyhiSVkLCCCYFY3pFkmr5gPVYVUsI9-ayDH6luV5p88HroqYtKz9_R0s7qVvV-6uiPn1vK0nHw_Uwb25vVm-MQhvNC_xrXjUaFQM_RG6piVMsDuXUqTDa56IYc65fj7i09vL_ud9tD6iuYU4FcO1magisjuLagEa3BogBZlQ03zmreWMcdlw3oEgFRC6MZsDVqC8k25Ol_1ltrT2P0nYrL6fID9gtawVLU</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Kam Meng Chong</creator><creator>Hang Keang Lim</creator><creator>Chin Seng Ong</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2003</creationdate><title>Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array</title><author>Kam Meng Chong ; Hang Keang Lim ; Chin Seng Ong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-724cf86d54ad74ce0c22ed2550896b4dfec4bef4f48b0c62022c7dc303e0ce583</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Assembly</topic><topic>Electronics packaging</topic><topic>Encapsulation</topic><topic>Equations</topic><topic>Fixtures</topic><topic>Flip chip</topic><topic>Metrology</topic><topic>Silicon</topic><topic>Tensile stress</topic><topic>Thermal stresses</topic><toplevel>online_resources</toplevel><creatorcontrib>Kam Meng Chong</creatorcontrib><creatorcontrib>Hang Keang Lim</creatorcontrib><creatorcontrib>Chin Seng Ong</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kam Meng Chong</au><au>Hang Keang Lim</au><au>Chin Seng Ong</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array</atitle><btitle>Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003</btitle><stitle>IPFA</stitle><date>2003</date><risdate>2003</risdate><spage>97</spage><epage>102</epage><pages>97-102</pages><isbn>9780780377226</isbn><isbn>0780377222</isbn><abstract>In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.</abstract><pub>IEEE</pub><doi>10.1109/IPFA.2003.1222746</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9780780377226 |
| ispartof | Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003, 2003, p.97-102 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_1222746 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Electronics packaging Encapsulation Equations Fixtures Flip chip Metrology Silicon Tensile stress Thermal stresses |
| title | Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T21%3A46%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Flip%20chip%20silicon%20fracture%20mechanism%20with%203-point%20bend%20metrology%20on%20flip%20chip%20ball%20grid%20array&rft.btitle=Proceedings%20of%20the%2010th%20International%20Symposium%20on%20the%20Physical%20and%20Failure%20Analysis%20of%20Integrated%20Circuits.%20IPFA%202003&rft.au=Kam%20Meng%20Chong&rft.date=2003&rft.spage=97&rft.epage=102&rft.pages=97-102&rft.isbn=9780780377226&rft.isbn_list=0780377222&rft_id=info:doi/10.1109/IPFA.2003.1222746&rft_dat=%3Cieee_6IE%3E1222746%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1222746&rfr_iscdi=true |