Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array

Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array

In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.

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Bibliographische Detailangaben
Hauptverfasser: Kam Meng Chong, Hang Keang Lim, Chin Seng Ong
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Assembly
Electronics packaging
Encapsulation
Equations
Fixtures
Flip chip
Metrology
Silicon
Tensile stress
Thermal stresses
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Beschreibung
Zusammenfassung:In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.
DOI:10.1109/IPFA.2003.1222746