Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications

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Hauptverfasser:	Yau, E.W.C., Hong, D.F.W., Chan, P.C.H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Analysis of variance Bonding processes Electronics industry Electronics packaging Environmentally friendly manufacturing techniques Flip chip Lead Ovens Temperature Wafer bonding
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container_end_page	1861
container_issue
container_start_page	1856
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creator	Yau, E.W.C. Hong, D.F.W. Chan, P.C.H.
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doi_str_mv	10.1109/ECTC.2003.1216557
format	Conference Proceeding
fullrecord	<record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1216557</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1216557</ieee_id><sourcerecordid>1216557</sourcerecordid><originalsourceid>FETCH-LOGICAL-i173t-57fa19ced8e850cd797ac56e478920ee472482085360a8ee1c8b01d0e616c2b23</originalsourceid><addsrcrecordid>eNo9kG9LwzAQxoN_wDn3AcQ3-QKtl7Rp0pdStikMBJ2vR5peXaRrStNO_DR-VWMdwnEHzz334-4IuWUQMwb5_bLYFjEHSGLGWSaEPCMznkgZCcmzc7LIpYIQQckZvyAzEFkeCQHJFbn2_gMgBWBqRr6XR92MerCupa6mwx6pO2JLe6wb90lL11a2fae6rWjd2I6afUi_Kvb_zTDXoA6GHpG-thDLYqTeNZNnPHRY0coGbksDMjLOD3T1EqXUj6Ufej0grV0_4aMJr7uusWbayd-Qy1o3HhenOidvq-W2eIw2z-un4mETWSaTIVxda5YbrBQqAaaSudRGZJhKlXPAUHmqOCiRZKAVIjOqBFYBZiwzvOTJnNz9cS0i7rreHnT_tTv9NvkB-FBsgg</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Yau, E.W.C. ; Hong, D.F.W. ; Chan, P.C.H.</creator><creatorcontrib>Yau, E.W.C. ; Hong, D.F.W. ; Chan, P.C.H.</creatorcontrib><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9780780377912</identifier><identifier>ISBN: 0780377915</identifier><identifier>EISSN: 2377-5726</identifier><identifier>DOI: 10.1109/ECTC.2003.1216557</identifier><language>eng</language><publisher>IEEE</publisher><subject>Analysis of variance ; Bonding processes ; Electronics industry ; Electronics packaging ; Environmentally friendly manufacturing techniques ; Flip chip ; Lead ; Ovens ; Temperature ; Wafer bonding</subject><ispartof>53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1856-1861</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1216557$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1216557$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Yau, E.W.C.</creatorcontrib><creatorcontrib>Hong, D.F.W.</creatorcontrib><creatorcontrib>Chan, P.C.H.</creatorcontrib><title>Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications</title><title>53rd Electronic Components and Technology Conference, 2003. Proceedings</title><addtitle>ECTC</addtitle><subject>Analysis of variance</subject><subject>Bonding processes</subject><subject>Electronics industry</subject><subject>Electronics packaging</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Flip chip</subject><subject>Lead</subject><subject>Ovens</subject><subject>Temperature</subject><subject>Wafer bonding</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9780780377912</isbn><isbn>0780377915</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9kG9LwzAQxoN_wDn3AcQ3-QKtl7Rp0pdStikMBJ2vR5peXaRrStNO_DR-VWMdwnEHzz334-4IuWUQMwb5_bLYFjEHSGLGWSaEPCMznkgZCcmzc7LIpYIQQckZvyAzEFkeCQHJFbn2_gMgBWBqRr6XR92MerCupa6mwx6pO2JLe6wb90lL11a2fae6rWjd2I6afUi_Kvb_zTDXoA6GHpG-thDLYqTeNZNnPHRY0coGbksDMjLOD3T1EqXUj6Ufej0grV0_4aMJr7uusWbayd-Qy1o3HhenOidvq-W2eIw2z-un4mETWSaTIVxda5YbrBQqAaaSudRGZJhKlXPAUHmqOCiRZKAVIjOqBFYBZiwzvOTJnNz9cS0i7rreHnT_tTv9NvkB-FBsgg</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Yau, E.W.C.</creator><creator>Hong, D.F.W.</creator><creator>Chan, P.C.H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2003</creationdate><title>Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications</title><author>Yau, E.W.C. ; Hong, D.F.W. ; Chan, P.C.H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i173t-57fa19ced8e850cd797ac56e478920ee472482085360a8ee1c8b01d0e616c2b23</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Analysis of variance</topic><topic>Bonding processes</topic><topic>Electronics industry</topic><topic>Electronics packaging</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Flip chip</topic><topic>Lead</topic><topic>Ovens</topic><topic>Temperature</topic><topic>Wafer bonding</topic><toplevel>online_resources</toplevel><creatorcontrib>Yau, E.W.C.</creatorcontrib><creatorcontrib>Hong, D.F.W.</creatorcontrib><creatorcontrib>Chan, P.C.H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yau, E.W.C.</au><au>Hong, D.F.W.</au><au>Chan, P.C.H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications</atitle><btitle>53rd Electronic Components and Technology Conference, 2003. Proceedings</btitle><stitle>ECTC</stitle><date>2003</date><risdate>2003</risdate><spage>1856</spage><epage>1861</epage><pages>1856-1861</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9780780377912</isbn><isbn>0780377915</isbn><pub>IEEE</pub><doi>10.1109/ECTC.2003.1216557</doi><tpages>6</tpages></addata></record>
fulltext	fulltext_linktorsrc
identifier	ISSN: 0569-5503
ispartof	53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1856-1861
issn	0569-5503 2377-5726
language	eng
recordid	cdi_ieee_primary_1216557
source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Analysis of variance Bonding processes Electronics industry Electronics packaging Environmentally friendly manufacturing techniques Flip chip Lead Ovens Temperature Wafer bonding
title	Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applications
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T01%3A53%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Evaluation%20of%20the%20oven%20reflow%20bonding%20and%20flip%20chip%20bonder%20bonding%20of%20lead%20free%20Sn0.7Cu%20solder%20bumped%20die%20on%20low-cost%20FR-4%20substrate%20for%20flip-chip%20applications&rft.btitle=53rd%20Electronic%20Components%20and%20Technology%20Conference,%202003.%20Proceedings&rft.au=Yau,%20E.W.C.&rft.date=2003&rft.spage=1856&rft.epage=1861&rft.pages=1856-1861&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9780780377912&rft.isbn_list=0780377915&rft_id=info:doi/10.1109/ECTC.2003.1216557&rft_dat=%3Cieee_6IE%3E1216557%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1216557&rfr_iscdi=true