A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applications

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Hauptverfasser:	Yau, E.W.C., Gong, J.F., Hong, B.F.W., Chan, P.C.H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Circuit testing Electronic waste Environmentally friendly manufacturing techniques Gold Inspection Lead Printing Reliability engineering Temperature Tin
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creator	Yau, E.W.C. Gong, J.F. Hong, B.F.W. Chan, P.C.H.
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doi_str_mv	10.1109/ECTC.2003.1216297
format	Conference Proceeding
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source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Circuit testing Electronic waste Environmentally friendly manufacturing techniques Gold Inspection Lead Printing Reliability engineering Temperature Tin
title	A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applications
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