Packaging Technology for the NEC SX Supercomputer

Technological considerations in realizing high-speed supercomputers are presented, focusing on large-scale integrated (LSI) chips, new circuit packaging technology, and a liquid cooling system. The Model SX-1 and SX-2 supercomputers employ a new circuit packaging technology achieving up to 1300 mega...

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Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1985-12, Vol.8 (4), p.462-467
Hauptverfasser:	Watari, T., Murano, H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Cache memory Delay effects Integrated circuit technology Large scale integration Liquid cooling Logic National electric code Packaging machines Semiconductor device packaging Supercomputers
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