Improved Electrical Performance Required for Future MOS Packaging

High speed integrated circuit (IC) families and the demands which these devices place on interconnection and power systems are compared, concluding that new materials, components, and packaging techniques are required to provide a nonlimiting electrical environment for high performance systems using...

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Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1983-09, Vol.6 (3), p.283-289
Hauptverfasser:	Schaper, L., Amey, D.
Format:	Artikel
Sprache:	eng
Schlagworte:	CMOS logic circuits CMOS technology Frequency High speed integrated circuits Integrated circuit interconnections Integrated circuit packaging MOS devices Power supplies Power system interconnection Voltage
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Beschreibung
Zusammenfassung:	High speed integrated circuit (IC) families and the demands which these devices place on interconnection and power systems are compared, concluding that new materials, components, and packaging techniques are required to provide a nonlimiting electrical environment for high performance systems using metal-oxide semiconductor (MOS) technologies.
ISSN:	0148-6411 1558-3082
DOI:	10.1109/TCHMT.1983.1136189