Wafer-Scale Fabricated MEMS-type Ionization Vacuum Sensors Based on Through Glass Via Technology

The paper presents a MEMS-type ionization vacuum sensor fabricated in batch on 4-in wafers based on through glass via (TGV) technology. The utilization of TGV technology enables the sensor to exhibit a compact three-layer stacked structure, where an yttrium oxide thermionic electron emitter and an ion collector are assembled in the same TGV layer. In addition to the compact dimensions of only 14×9×3.6 mm 3 , the wafer-scale fabricated sensors exhibit a wide measurement range from 1×10 -4 Pa to 40 Pa, an improved sensitivity of 0.019 Pa -1 and a production yield of 94%. All these results imply the promising applications of our sensors for vacuum measurement, especially for in-situ vacuum monitoring in vacuum electronic devices.