Spatially Resolved Conductivity of Rectangular Interconnects Considering Surface Scattering-Part II: Circuit-Compatible Modeling

In Part I of this work, we had presented a spatially resolved model for conductivity of interconnects capturing surface scattering based on the well-known Fuchs-Sondheimer (FS) approach. However, the proposed spatially resolved FS (SRFS) model involves computing complicated integrals making it ill-s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on electron devices 2024-11, Vol.71 (11), p.6950-6957
Hauptverfasser: Chen, Xinkang, Kumar Gupta, Sumeet
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In Part I of this work, we had presented a spatially resolved model for conductivity of interconnects capturing surface scattering based on the well-known Fuchs-Sondheimer (FS) approach. However, the proposed spatially resolved FS (SRFS) model involves computing complicated integrals making it ill-suited for circuit simulations. In this part, we build upon our SRFS model to develop a circuit-compatible conductivity model for rectangular interconnects accounting for 2-D surface scattering. The proposed circuit-compatible model offers spatial resolution of conductivity as well as explicit dependence on the physical parameters such as electron mean free path ( \lambda _{{0}} ), specularity (p), and interconnect geometry. We validate our circuit-compatible model over a range of physical parameters showing a close match with the physical SRFS model proposed in Part I (with error
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2024.3467029