BS-PDN Implemented the Latest Logic Devices for 14 Angstrom Technology Node

This study extensively examines the relative cost-competitiveness between front-side (FS) and back-side (BS) power delivery networks (PDNs), ranging from the latest 200 nm height of the standard cell (STC) to the 14-angstrom node (A14). FS and BS-PDN necessitate a higher area increase rate for small...

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Veröffentlicht in:IEEE transactions on electron devices 2024-07, Vol.71 (7), p.4028-4032
Hauptverfasser: Lee, Junjong, Seungchul Song, Stanley, Baek, Rock-Hyun
Format: Artikel
Sprache:eng
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Zusammenfassung:This study extensively examines the relative cost-competitiveness between front-side (FS) and back-side (BS) power delivery networks (PDNs), ranging from the latest 200 nm height of the standard cell (STC) to the 14-angstrom node (A14). FS and BS-PDN necessitate a higher area increase rate for smaller technology nodes to meet the IR drop criterion. In the 3-nm node (N3) and below, power via (PV) requires a high area increase rate, posing challenges in competing with FS-PDN, especially for high-density (HD) cells. Depending on process conditions, the buried power rail (BPR) and BS contact (BSC) may also require additional area, although ideally, they do not. Consequently, BS-PDN becomes competitive through scaling. Nonetheless, in mobile system-on-chip (SOC), the added process cost of BS-PDN must be small to be a cost-effective alternative compared to FS-PDN even at A14. This study guides the return on investment (ROI) when adopting BS-PDN options.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2024.3403796