A Dual-Signaling Architecture for Enhancing Noise Resilience in Floquet Engineering-Based Chip-Scale Wireless Communication

In this study, we introduce a novel theoretical framework for detecting and decoding Terahertz (THz) frequency chip-scale wireless communication signals. By considering the quantum behavior of charge carriers exposed to intense time-periodic radiation, we employ Floquet engineering techniques for system analysis. Using a two-dimensional semiconductor quantum well (2DSQW) based voltage divider, we showcase the detection and decoding of frequency modulated signals at nanoscale dimensions. Exploring noise impact within the Floquet-2DSQW framework, we identify voltage shifts that compromise data demodulation in single signaling setups. To address this challenge, we suggest a dynamic dual-signaling Floquet-2DSQW architecture that adapts the reference voltage to prevalent noise effects in chip-scale environments. Through a numerical analysis configured for Gigabit per second (Gbps) data transmission in the THz carrier frequency range, we show that our dual-signaling approach surpasses conventional single signaling setups, significantly reducing the bit error rate across various signal-to-noise ratio (SNR) values. A comprehensive parametric study emphasizes the importance of correlated noise effects at two 2DSQW receivers for enhanced performance. Our findings offer valuable insights for advancing nanoscale wireless communication within or between chips in noisy conditions, with potential applications in high-speed, reliable data transfer.