400-nm InGaN-GaN and InGaN-AlGaN multiquantum well light-emitting diodes

The 400-nm In/sub 0.05/Ga/sub 0.95/N-GaN MQW light-emitting diode (LED) structure and In/sub 0.05/Ga/sub 0.95/N-Al/sub 0.1/Ga/sub 0.9/N LED structure were both prepared by organometallic vapor phase epitaxy. It was found that the use of Al/sub 0.1/Ga/sub 0.9/N as the material for barrier layers woul...

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Veröffentlicht in:IEEE journal of selected topics in quantum electronics 2002-07, Vol.8 (4), p.744-748
Hauptverfasser: Chang, S.J., Kuo, C.H., Su, Y.K., Wu, L.W., Sheu, J.K., Wen, T.C., Lai, W.C., Chen, J.R., Tsai, J.M.
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Sprache:eng
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Zusammenfassung:The 400-nm In/sub 0.05/Ga/sub 0.95/N-GaN MQW light-emitting diode (LED) structure and In/sub 0.05/Ga/sub 0.95/N-Al/sub 0.1/Ga/sub 0.9/N LED structure were both prepared by organometallic vapor phase epitaxy. It was found that the use of Al/sub 0.1/Ga/sub 0.9/N as the material for barrier layers would not degrade crystal quality of the epitaxial layers. It was also found that the 20-mA electroluminescence intensity of InGaN-AlGaN multiquantum well (MQW) LED was two times larger than that of the InGaN-GaN MQW LED. The larger maximum output intensity and the fact that maximum output intensity occurred at larger injection current suggest that AlGaN barrier layers can provide a better carrier confinement and effectively reduce leakage current.
ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2002.801677