Isothermal em as highly accelerated test method for copper damascene lines

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Hauptverfasser:	Kin Leong, Yap Andrew, Bee Hoon Lim, Eng Chye Chua, Yeow Kheng Lim, Suat Cheng, Khoo Sherry
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Circuit testing Copper Electromigration Integrated circuit interconnections Isothermal processes Life estimation Packaging Semiconductor device testing Temperature Thermal stresses
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creator	Kin Leong Yap Andrew Bee Hoon Lim Eng Chye Chua Yeow Kheng Lim Suat Cheng Khoo Sherry
description
doi_str_mv	10.1109/IPFA.2002.1025631
format	Conference Proceeding
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source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Circuit testing Copper Electromigration Integrated circuit interconnections Isothermal processes Life estimation Packaging Semiconductor device testing Temperature Thermal stresses
title	Isothermal em as highly accelerated test method for copper damascene lines
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