Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications
This letter reports, for the first time, the ultralow insertion loss (IL) of substrate-integrated waveguides (SIWs) in alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc., for millimeter-wave (mm-wave) packaging applications. Demonstrated on an 80- \mu m-thi...
Gespeichert in:
Veröffentlicht in: | IEEE microwave and wireless technology letters (Print) 2023-10, Vol.33 (10), p.1-0 |
---|---|
Hauptverfasser: | , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This letter reports, for the first time, the ultralow insertion loss (IL) of substrate-integrated waveguides (SIWs) in alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc., for millimeter-wave (mm-wave) packaging applications. Demonstrated on an 80- \mu m-thick ARC substrate using a semi-additive patterning (SAP) process, SIWs are fed by broadband microstrip taper transitions and characterized based on conductor-backed coplanar waveguide (CBCPW)-to-microstrip transitions and microstrip feedlines in 75-110 GHz (W-band) and 110-170 GHz (D-band), respectively. Using two-tier calibration, the average measured IL of ARC-based SIWs in W-and D-bands is extracted to be 0.13 \pm 0.02 and 0.155 \pm 0.01 dB/mm, respectively, showing an excellent agreement with simulated and theoretical modeling results. According to comparisons, SIWs on ARC outperform those on other substrates in terms of IL over 75-170 GHz, exhibit excellent performance, and provide easier fabrication as compared to air-filled SIWs. These first results reveal the potential of ARC substrates for the development of ultrathin, high-performance passive components and modules based on SIW technology in mm-wave frequency ranges. |
---|---|
ISSN: | 2771-957X 2771-9588 |
DOI: | 10.1109/LMWT.2023.3304949 |