Sea of leads microwave characterization and process integration with FEOL and BEOL

Complete front-end-of-the-line (FEOL), back-end-of-the-line (BEOL), and Sea of Leads (SoL) process integration is reported with the end result being fully packaged CMOS dice at wafer-level. In addition, SoL microwave characterization in the 0.1-45 GHz frequency range demonstrates that the insertion-loss decreases with increasing lead thickness and decreasing lead length. Worst case insertion-loss for signal path into- and out- of the package was measured at wafer-level to be 1.15 dB at 45 GHz. Crosstalk between parallel leads was approximately -30 dB at 45 GHz. Finally, the fabrication of a high-density substrate for SoL using low cost multi-crystalline Si is reported.