Examination of thermal test chip designs using an FEA tool

Thermal test chip is widely used for package thermal characterization. An "ideal" test chip should be designed in such a way that the heating element covers the entire die area and the heat is generated uniformly across the die. Unfortunately, due to the constraint of other testing structu...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Chia-Pin Chiu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chip scale packaging Heat sinks Heat transfer Heating Surface impedance Temperature measurement Temperature sensors Testing Thermal conductivity Thermal factors
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