Influence of Bitartrate Ion Concentration in the Copper Electrodeposition Onto a Polycrystalline Gold Electrode

In the present work, the influence of the concentration of bitartrate ions (HT) on the copper electrodeposition process was analyzed. The study was carried out from an aqueous solution containing 0.001 M of CuX (where X = (NO[3.sup.-])2 ,([Cl.sup.-])2, SO[4.sup.2-]) and x M KHT (where x = 0.005 M, 0.01 M, and 0.015 M). From voltammetric and chronoamperometric studies, the results indicate that copper electrodeposition is a diffusion-controlled process. The current density transients were well described through a kinetic mechanism involving capacitive and faradaic contributions. The diffusion coefficient values of [Cu.sup.1+] and [Cu.sup.2+] result to be similar at the different concentration values of potassium bitartrate used in this work. Keywords: copper, acid bitartrate ions, kinetic, copper, electrodeposition.