Computational and Experimental Analysis of a Triode Microfuse with a WO3 Heater

In this study, high-current-protecting multilayered thin film microfuses are designed and simulated using the MEMS-based tool of COMSOL multiphysics software and then fabricated and tested in the laboratory. Portable electronic devices are comprised of a secondary battery or DC charge source, and due to short circuit overcurrent, fire, and explosions can ensue. A protecting device should steadily cater to phenomena like overcurrent situations to avoid hazardous circumstances. The primary purpose of this investigation is to design a heater resistor with a negative temperature coefficient (NTC) to function as a low melting point-based alloy for the fuse element. A lead-tin (90Pb:10Sn wt.%) alloy has been employed as the low melting point-based fuse element, and tungsten oxide (WO3) is integrated with the layer as a heater resistor due to its negative temperature coefficient of resistance characteristics. The electro-thermo-mechanical behavior is assessed, and a three-dimensional structural modeling and simulation technique has been performed in both steady-state and transient conditions with varying physical and electrical parameters. The heat required to melt the fuse depends on heater geometry, and when we applied 2 A current to the 1 : 30 length and width ratio-based device, the heater achieved 600 K. Experimentally, nearly at 1 A current and above 4 V, the microfuse reached melting temperature and thus has been blown which provides a scope of controlling nearly 4 W of power electronic devices.