Multiphoton-initiated laser writing of semiconductors using nanosecond mid-infrared pulses

•Semiconductor laser processing with mid-infrared 2.8-μm and 2.5-ns pulses.•Multiphoton-initiated front, bulk, and rear surface processing of Si, InP, and GaAs.•Si volume processing through germanium for multilayered chips.•3D pattern writing with positive refractive index variation of 0.5% The advent of more powerful mid-infrared nanosecond laser sources allows using them as attractive tools in material laser processing. For semiconductor bulk processing, laser intensities must remain modest to avoid detrimental nonlinear propagation and pre-focal plasma screening effects. Accordingly, nanosecond pulses are usually appropriate to locally initiate energy deposition by multiphoton absorption and subsequent modification, hardly achievable with ultrashort pulses. Employing a 2.8-μm 2.5-ns laser source, we explore the possibility to modify silicon and other semiconductors. With interactions initiated by three-photon absorption, we modify and determine the surface and bulk modification thresholds of Si, GaAs, and InP. For Si, compared to previous studies at telecom wavelengths, we report on a reduction of the energy threshold for volume modification with processing depth, and repeatable rear-surface modifications. Compared to Si, we find for GaAs and InP important fluctuations in the modification responses, which we attribute to an absorption mechanism initially triggered by a greater presence of defects. We also study germanium, as this narrower bandgap semiconductor very interesting for mid-infrared electro-optical applications is transparent at the newly introduced wavelength. Despite the ability to modify the surface, the bulk of Ge remains inaccessible in this two-photon regime, mainly attributed to beam aberrations and nonlinearities. Nonetheless, we demonstrate the ability to process Si chips integrating Ge layers. All these results showcase the potential of mid-infrared wavelengths to offer new degrees of flexibility for 3D laser processing technologies turned to silicon photonics and microelectronics packaging.