Impact of Sterilization on the Adhesion Properties of a Polyamide 11 Coating on Textured Metal Substrates

Polyamide materials are widely used for medical device coating. However, despite the fragile area at the interface, these devices must conserve their physical and mechanical performance after the sterilization process. In this work, the impact of steam sterilization, widely used in the medical sector, on the adhesion properties of biocompatible and biosourced polyamide-11-coated copper substrates was assessed. The adhesion strength, a quantitative indicator of the coating performance, was assessed thanks to a laboratory-made bench test. The surface of metal substrates was microstructured with laser engraving to enhance the coating adhesion. The Ra roughness value was varied to verify if the depth of valleys induced with the femtosecond laser could favor the interfacial anchoring. Scanning electron microscopy analyses highlighted the physical surface evolution of the polymer analyzed at the interface, across the various texturing parameter values, Ra. Fourier transform infrared spectroscopy was used to monitor the bands specific to polyamide thermo-oxidative degradation. Elemental composition deduced from X-ray photoelectron spectroscopy carried out on the coating after mechanical debonding clearly revealed that the chemical stability of the copper substrates was affected rather than the polyamide coating. Also, we discussed the impact of the chosen sterilization parameters (steam and pressure) on the formation of copper-based species detected with this technique.