Atmospheric Pressure Low Temperature Direct Plasma Technology: Status and Challenges for Thin Film Deposition

Over the last ten years, expansion of atmospheric pressure plasma solutions for surface treatment of materials has been remarkable, however direct plasma technology for thin film deposition needs still great effort. The objective of this paper is to establish the state of the art on scientific and technologic locks, which have to be opened to consider direct atmospheric pressure plasma‐enhanced chemical vapor deposition (AP‐PECVD) a viable option for industrial application. Basic scientific principles to understand and optimize an AP‐PECVD process are summarized. Laboratory reactor configurations are reviewed. Reference points for the design and use of AP‐PECVD reactors according to the desired thin film properties are given. Finally, solutions to avoid powder formation and to increase the thin film growth rate are discussed. The aim of this review is to contribute to find a solution for AP‐PECVD of dense film at a growth rate suitable for industrial applications. It compares the different plasma sources, the different reactor configurations, power supplies, precursors nature to try to point out advantages and drawbacks, and converge to the best solution.