Large-area soft e-skin: The challenges beyond sensor designs

Large-area soft e-skin: The challenges beyond sensor designs

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Veröffentlicht in:Proceedings of the IEEE 2019, Vol.107 (10), p.2016-2033
Hauptverfasser: Dahiya, Ravinder, Yogeswaran, Nivasan, Liu, Fengyuan, Manjakkal, Libu, Burdet, Etienne, Hayward, Vincent, Jörntell, Henrik
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Automatic
Engineering Sciences
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container_end_page 2033
container_issue 10
container_start_page 2016
container_title Proceedings of the IEEE
container_volume 107
creator Dahiya, Ravinder
Yogeswaran, Nivasan
Liu, Fengyuan
Manjakkal, Libu
Burdet, Etienne
Hayward, Vincent
Jörntell, Henrik
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subjects Automatic
Engineering Sciences
title Large-area soft e-skin: The challenges beyond sensor designs
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