Fabrication of Superhydrophobic Hierarchical Surfaces by Square Pulse Electrodeposition: Copper‐Based Layers on Gold/Silicon (100) Substrates

Copper based layers were fabricated on gold/silicon (100) substrates by using square pulse electrodeposition at different deposition temperatures. The predominant crystalline plane on Cu2O samples at temperatures higher than 30 °C is (111), which is the most hydrophobic facet of Cu2O cubic structure. Different crystallite structures such as semivertical leaves, fractal trees, and octahedral pyramids were formed on the surface. These water‐repellent samples have hierarchical structures, including octahedral pyramid microstructures with small spherical balls on them and well‐branched micrometric vertical leaves on the surface. They provide a suitable surface for trapping air pockets inside the structure and increasing the water contact angle up to 154°. This approach may be applicable to the large‐scale preparation of water‐repellent surfaces as superhydrophobicity can be achieved in a one‐step deposition process without any secondary modifications. Superhydrophobic hierarchical copper‐based surfaces: Different surface structures, including octahedral pyramids, dendrite leaves, and hierarchical structures were fabricated by using pulsed potential electrodeposition at various bath temperatures. Increasing the bath temperature has a big impact on the complexity of the surface structures as well as roughness, as the extra thermal energy increases the deposition rate. These structures provide a suitable surface for trapping air pockets and increasing the water contact angle up to 154°.