Reliability analysis of tape based chip-scale packages based metamodel
In the mechatronic devices, finite element methods (FEM) are widely used to determine the fatigue response of solder joints subjected to thermal loading. These life cycle analyses are often deterministic. However, experience shows that design variables present variability that affects prediction qua...
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Veröffentlicht in: | Microelectronics and reliability 2019-11, Vol.102, p.113445, Article 113445 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | In the mechatronic devices, finite element methods (FEM) are widely used to determine the fatigue response of solder joints subjected to thermal loading. These life cycle analyses are often deterministic. However, experience shows that design variables present variability that affects prediction quality. This paper describes a method for predicting the solder joints reliability in Tape based Chip Scale Packaging (T-CSP) with consideration of uncertainties in material properties. The proposed approach, which is based on the metamodeling techniques, combines FEM, metamodels and Monte Carlo simulation (MCS). Once validated, the constructed metamodel is used to perform the MCS. This probabilistic method has sufficient efficiency and accuracy to analyze the reliability of T-CSPs.
•Finite element analysis has been applied to predict solder joints fatigue response of a T-CSP under loading conditions.•The metamodel is built and validated based on the input parameters and their responses from deterministic FEM simulations.•We propose an approach for predicting the reliability of mechatronic packages with consideration of uncertainties.•The probabilistic method has enough efficiency and accuracy to analyze the reliability of T-CSPs. |
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ISSN: | 0026-2714 1872-941X |
DOI: | 10.1016/j.microrel.2019.113445 |