Reliability and failure analysis in power GaN-HEMTs during S-band pulsed-RF operating

This paper reports a reliability study on two technologies of AlGaN/GaN high-electron mobility transistors (AlGaN/GaN HEMTs) (Device “A” and Device “B”). A failure analysis study is conducted on devices stressed under real operating conditions for radar applications. The devices underwent pulsed-RF long ageing tests and after 11,000 h show a degradation in RF and DC performances (Drop of drain current and RF output power, pinch-off shift, decrease of the maximum of transconductance, lateral translation of transconductance, and increase of gate-lag and drain-lag). Hot electron effects are supposed to be the origin of the observed degradations and trapping phenomena within the passivation or GaN layers. Photon emission microscopy (PEM), Optical Beam Induced Resistance Change (OBIRCH), Electron Beam Induced Current (EBIC) measurements concur with this hypothesis. The three techniques reveal a non-uniform response and an inhomogeneous distribution along the gate fingers, in addition to the presence of some localized spots localized on the gate edge either on the drain side or on the source side. Spectral PEM analysis of these spots identifies a native defect that could be related to crystallographic defects such as dislocations or impurities. Atom probe tomography (APT) analysis on the two technologies of AlGaN/GaN HEMTs supports this hypothesis. APT results show the presence of some chemical impurities like carbon and oxygen. These impurities are in relatively significant concentrations in device “A” which could explain the high level of gate-lag and drain-lag in this device compared to device “B”.