DLI-CVD of TiO2-Cu antibacterial thin films: Growth and characterization

TiO2–Cu nanocomposite films were grown by pulsed direct liquid injection chemical vapor deposition (DLICVD) on stainless steel, silicon and glass substrates with the goal to produce bactericidal surfaces. Copper bis (2,2,6,6-tetramethyl-3,5-heptadionate), Cu(TMHD)2, and titanium tetra-iso-propoxide, TTIP, were used as metalorganic precursors. Liquid solutions of these compounds in xylene were injected in a flash vaporization chamber connected to a cold wall MOCVD reactor. The deposition temperature was typically 683 K and the total pressure was 800 Pa. The copper content of the layers was controlled by the mole fraction of Cu (TMHD)2 which was adjusted by the injection parameters (injection frequency and concentration of the starting solution). The chemical, structural and physical characteristics of the films were investigated by XRD, XPS, FEG-SEM and TEM. Copper is incorporated as metal particles with a relatively large size distribution ranging from 20 to 400 nm (with a large majority in 20–100 nm) depending on the copper content of the films. The influence of the growth conditions on the structural features and the antibacterial properties of the thin films are reported and discussed.