In-line monitoring of the injection molding process by dielectric spectroscopy

In recent years, electrical techniques like microdielectrometry have increasingly been utilized for their ability to continuously monitor, in a nondestructive way, the advancement of the reaction of thermoset resins under cure. This paper discusses an extension of this technique for the “in‐situ” monitoring of the crystallization of thermoplastics applied during an injection molding process. Electric sensors were positioned at the walls of the mold cavity so that an analysis of the volume dielectric properties of material during the filling, the post‐filling, and the cooling steps could be carried out. Poly(vinylidene fluoride) was chosen for this study. A correlation between the evolution of the dielectric parameters and the succession of the steps in this process was undertaken. The dielectric response was sufficiently sensitive to identify the steps of the closing of the mold, filling, post‐filling, cooling, and ejection of the part. In addition, information concerning the crystallization phenomenon near the wall or in the middle of the sample was collected. The gradual filling of the cavity of the mold was also identified by dielectric measurements. The temperature dependence of dielectric properties of the sample was beneficial in evaluating the increase of the temperature of the mold with the succession of injection cycles. The influence of the packing pressure has been clearly identified and confirms the usefulness of the dielectric method as a probe for detecting the shrinkage of the part during the optimization phase of the machine parameters. The dielectric method detailed herein provides a new non‐invasive technique and could be applied to a closed‐loop control of the injection molding process.