A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques
A comparison of crystallinity, microstructure, surface morphology and electrical conductivity is proposed for the deposition of copper films, using supercritical fluid chemical deposition (SFCD) and RF magnetron sputtering techniques. Both preparation methods yield nanocrystalline Cu films (
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| Veröffentlicht in: | Thin solid films 2017-12, Vol.643, p.53-59 |
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| container_title | Thin solid films |
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| creator | Giroire, B. Ali Ahmad, M. Aubert, G. Teule-Gay, L. Michau, D. Watkins, J.J. Aymonier, C. Poulon-Quintin, A. |
| description | A comparison of crystallinity, microstructure, surface morphology and electrical conductivity is proposed for the deposition of copper films, using supercritical fluid chemical deposition (SFCD) and RF magnetron sputtering techniques. Both preparation methods yield nanocrystalline Cu films ( |
| doi_str_mv | 10.1016/j.tsf.2017.09.002 |
| format | Article |
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| language | eng |
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| source | Access via ScienceDirect (Elsevier) |
| subjects | Chemical Sciences Copper Material chemistry Microstructure Resistivity Sputtering Supercritical fluid chemical deposition Thin films |
| title | A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques |
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