A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

A comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques

A comparison of crystallinity, microstructure, surface morphology and electrical conductivity is proposed for the deposition of copper films, using supercritical fluid chemical deposition (SFCD) and RF magnetron sputtering techniques. Both preparation methods yield nanocrystalline Cu films (

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Bibliographische Detailangaben
Veröffentlicht in:Thin solid films 2017-12, Vol.643, p.53-59
Hauptverfasser: Giroire, B., Ali Ahmad, M., Aubert, G., Teule-Gay, L., Michau, D., Watkins, J.J., Aymonier, C., Poulon-Quintin, A.
Format: Artikel
Sprache:eng
Schlagworte:
Chemical Sciences
Copper
Material chemistry
Microstructure
Resistivity
Sputtering
Supercritical fluid chemical deposition
Thin films
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Zusammenfassung:A comparison of crystallinity, microstructure, surface morphology and electrical conductivity is proposed for the deposition of copper films, using supercritical fluid chemical deposition (SFCD) and RF magnetron sputtering techniques. Both preparation methods yield nanocrystalline Cu films (
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2017.09.002