Structure property relationships of biobased n-alkyl bisferulate epoxy resins

In this work, a series of bio-based chemically recyclable epoxy resins were synthesized from n-alkyl bisferulate esters that do not activate human estrogen receptor alpha (ER alpha ). Viscosities of corresponding glycidyl ether n-alkyl bisferulate resins, determined by steady shear rheology, range f...

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Veröffentlicht in:Green chemistry : an international journal and green chemistry resource : GC 2016-01, Vol.18 (18), p.4961-4973
Hauptverfasser: Maiorana, Anthony, Reano, Armando F, Centore, Robert, Grimaldi, Marina, Balaguer, Patrick, Allais, Florent, Gross, Richard A
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Sprache:eng
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Zusammenfassung:In this work, a series of bio-based chemically recyclable epoxy resins were synthesized from n-alkyl bisferulate esters that do not activate human estrogen receptor alpha (ER alpha ). Viscosities of corresponding glycidyl ether n-alkyl bisferulate resins, determined by steady shear rheology, range from 12-9.4 Pa s. Activation energies of flow range from 83-96 kJ mol-1 and are similar to the diglycidyl ether bisphenol A (DGEBA). Thermomechanical properties of diglycidyl ether n-alkyl bisferulate resins cured with isophorone diamine were governed by the length of alpha , omega -diols that link glycidyl ether ferulate units. That is, the glassy phase modulus and alpha transition temperatures range from 3400-2400 MPa (at 25 degree C) and 40-53 degree C (peak of E''), respectively. Furthermore, the onset of thermal degradation (Td5%) varied from 331-300 degree C. Chemical recycling of cured epoxy resins was performed by static immersion in 10 w/w sodium hydroxide aqueous solutions at 60 degree C. Times required for complete conversion of cured resins to water-soluble degradation products was also alpha , omega -diol length dependent and varied from 5 to 65 h. Thus, diglycidyl ether of n-alkyl bisferulate resins provides a viable biobased alternative to BPA epoxy resins as well as the option of chemical degradability and recovery of fillers in composite applications.
ISSN:1463-9262
1463-9270
DOI:10.1039/c6gc01308b