Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses
Thermal cycling in space environment can cause physical aging of polymers used in structural adhesive bonded joint. Later, they can initiate failure. A methodology to follow physical aging effects on their thermal, mechanical and dielectric properties is applied to a commercial epoxy adhesive. The a...
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| Veröffentlicht in: | Journal of non-crystalline solids 2014-03, Vol.387, p.57-61 |
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| container_title | Journal of non-crystalline solids |
| container_volume | 387 |
| creator | Causse, Nicolas Dantras, Eric Tonon, Claire Chevalier, Mathieu Combes, Hélène Guigue, Pascale Lacabanne, Colette |
| description | Thermal cycling in space environment can cause physical aging of polymers used in structural adhesive bonded joint. Later, they can initiate failure. A methodology to follow physical aging effects on their thermal, mechanical and dielectric properties is applied to a commercial epoxy adhesive. The analytic description, using Tool, Narayanaswamy and Moynihan model gives a good description of the enthalpy relaxation. It is completed by a phenomenological analysis of the evolution of the adhesive thermal transitions, mechanical properties and molecular mobility. Tested samples with bonded assembly are representative of in service configurations. The influence of physical aging on the adhesive and the associated bonded assemblies is analyzed.
•Physical aging effects on structural bonded assemblies are investigated.•A new sample configuration is proposed to explore the aging of adhesive.•The behavior of epoxy joints is discussed in terms of molecular mobility at Tg.•Methodology provides an original description of bonded assemblies' physical aging. |
| doi_str_mv | 10.1016/j.jnoncrysol.2013.12.028 |
| format | Article |
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•Physical aging effects on structural bonded assemblies are investigated.•A new sample configuration is proposed to explore the aging of adhesive.•The behavior of epoxy joints is discussed in terms of molecular mobility at Tg.•Methodology provides an original description of bonded assemblies' physical aging.</description><subject>Adhesively bonded joint</subject><subject>Condensed matter: electronic structure, electrical, magnetic, and optical properties</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Dielectric loss and relaxation</subject><subject>Dielectric properties of solids and liquids</subject><subject>Dielectrics, piezoelectrics, and ferroelectrics and their properties</subject><subject>Engineering Sciences</subject><subject>Enthalpy relaxation</subject><subject>Epoxy</subject><subject>Exact sciences and technology</subject><subject>Materials</subject><subject>Materials science</subject><subject>Mechanical and acoustical properties of condensed matter</subject><subject>Mechanical and dielectric relaxations</subject><subject>Physical aging</subject><subject>Physics</subject><subject>Solid solution, precipitation, and dispersion hardening; aging</subject><subject>Thermal properties of condensed matter</subject><subject>Thermal properties of crystalline solids</subject><subject>Thermodynamic properties</subject><subject>Treatment of materials and its effects on microstructure and properties</subject><issn>0022-3093</issn><issn>1873-4812</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNqFkM1uGyEURlGVSHWcvAObLiJlpvyMbcguidKmkqVukjW6w1w6WGMYgWNl3j64E6XLwgJddD7QdwihnNWc8fX3Xb0LMdg05TjUgnFZc1Ezob6QBVcbWTWKizOyYEyISjItv5KLnHesrI1UCzI9hkMPwzjRhAO8wcHHQMceQ9xjABodxTG-TRS6HrM_IvWBxhHTXxAGamNw_s_rPN_S5x7THoYbukfbQ_C2IBA62nkc0B6St2WEYcqYL8m5gyHj1ce5JC8_Hp8fnqrt75-_Hu62lW2kOFSuFVpyoWDdct6BtFYDuMZqpTqpmxbBSaWxtWvEDbo16xrWrpgu2zGwWi7J9fxuqWnG5PeQJhPBm6e7rTndMaZXTHB95IVVM2tTzDmh-wxwZk66zc78021Oug0Xpugu0W9zdIRcWrsEwfr8mRdKyJUuzpfkfuawdD56TCZbj8Fi51MxZLro___ZO8Fans8</recordid><startdate>20140301</startdate><enddate>20140301</enddate><creator>Causse, Nicolas</creator><creator>Dantras, Eric</creator><creator>Tonon, Claire</creator><creator>Chevalier, Mathieu</creator><creator>Combes, Hélène</creator><creator>Guigue, Pascale</creator><creator>Lacabanne, Colette</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>1XC</scope><scope>VOOES</scope><orcidid>https://orcid.org/0000-0002-0111-3184</orcidid><orcidid>https://orcid.org/0000-0002-5601-2217</orcidid></search><sort><creationdate>20140301</creationdate><title>Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses</title><author>Causse, Nicolas ; 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aging</topic><topic>Thermal properties of condensed matter</topic><topic>Thermal properties of crystalline solids</topic><topic>Thermodynamic properties</topic><topic>Treatment of materials and its effects on microstructure and properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Causse, Nicolas</creatorcontrib><creatorcontrib>Dantras, Eric</creatorcontrib><creatorcontrib>Tonon, Claire</creatorcontrib><creatorcontrib>Chevalier, Mathieu</creatorcontrib><creatorcontrib>Combes, Hélène</creatorcontrib><creatorcontrib>Guigue, Pascale</creatorcontrib><creatorcontrib>Lacabanne, Colette</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Hyper Article en Ligne (HAL)</collection><collection>Hyper Article en Ligne (HAL) (Open Access)</collection><jtitle>Journal of non-crystalline solids</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Causse, Nicolas</au><au>Dantras, Eric</au><au>Tonon, Claire</au><au>Chevalier, Mathieu</au><au>Combes, Hélène</au><au>Guigue, Pascale</au><au>Lacabanne, Colette</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses</atitle><jtitle>Journal of non-crystalline solids</jtitle><date>2014-03-01</date><risdate>2014</risdate><volume>387</volume><spage>57</spage><epage>61</epage><pages>57-61</pages><issn>0022-3093</issn><eissn>1873-4812</eissn><coden>JNCSBJ</coden><abstract>Thermal cycling in space environment can cause physical aging of polymers used in structural adhesive bonded joint. Later, they can initiate failure. A methodology to follow physical aging effects on their thermal, mechanical and dielectric properties is applied to a commercial epoxy adhesive. The analytic description, using Tool, Narayanaswamy and Moynihan model gives a good description of the enthalpy relaxation. It is completed by a phenomenological analysis of the evolution of the adhesive thermal transitions, mechanical properties and molecular mobility. Tested samples with bonded assembly are representative of in service configurations. The influence of physical aging on the adhesive and the associated bonded assemblies is analyzed.
•Physical aging effects on structural bonded assemblies are investigated.•A new sample configuration is proposed to explore the aging of adhesive.•The behavior of epoxy joints is discussed in terms of molecular mobility at Tg.•Methodology provides an original description of bonded assemblies' physical aging.</abstract><cop>Oxford</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jnoncrysol.2013.12.028</doi><tpages>5</tpages><orcidid>https://orcid.org/0000-0002-0111-3184</orcidid><orcidid>https://orcid.org/0000-0002-5601-2217</orcidid><oa>free_for_read</oa></addata></record> |
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| subjects | Adhesively bonded joint Condensed matter: electronic structure, electrical, magnetic, and optical properties Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Dielectric loss and relaxation Dielectric properties of solids and liquids Dielectrics, piezoelectrics, and ferroelectrics and their properties Engineering Sciences Enthalpy relaxation Epoxy Exact sciences and technology Materials Materials science Mechanical and acoustical properties of condensed matter Mechanical and dielectric relaxations Physical aging Physics Solid solution, precipitation, and dispersion hardening aging Thermal properties of condensed matter Thermal properties of crystalline solids Thermodynamic properties Treatment of materials and its effects on microstructure and properties |
| title | Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses |
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