Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses

Thermal cycling in space environment can cause physical aging of polymers used in structural adhesive bonded joint. Later, they can initiate failure. A methodology to follow physical aging effects on their thermal, mechanical and dielectric properties is applied to a commercial epoxy adhesive. The analytic description, using Tool, Narayanaswamy and Moynihan model gives a good description of the enthalpy relaxation. It is completed by a phenomenological analysis of the evolution of the adhesive thermal transitions, mechanical properties and molecular mobility. Tested samples with bonded assembly are representative of in service configurations. The influence of physical aging on the adhesive and the associated bonded assemblies is analyzed. •Physical aging effects on structural bonded assemblies are investigated.•A new sample configuration is proposed to explore the aging of adhesive.•The behavior of epoxy joints is discussed in terms of molecular mobility at Tg.•Methodology provides an original description of bonded assemblies' physical aging.