New biobased carboxylic acid hardeners for epoxy resins

Soybean oil was modified into a novel biobased polyacid hardener by thiol‐ene coupling with thioglycolic acid. The structure of the initial soybean oil and polyacid triglyceride was carefully analyzed using 1H NMR and titration. The thermal crosslinking reaction between acid hardener and epoxidized...

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Veröffentlicht in:European journal of lipid science and technology 2013-06, Vol.115 (6), p.698-708
Hauptverfasser: Jaillet, Fanny, Desroches, Myriam, Auvergne, Rémi, Boutevin, Bernard, Caillol, Sylvain
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Sprache:eng
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Zusammenfassung:Soybean oil was modified into a novel biobased polyacid hardener by thiol‐ene coupling with thioglycolic acid. The structure of the initial soybean oil and polyacid triglyceride was carefully analyzed using 1H NMR and titration. The thermal crosslinking reaction between acid hardener and epoxidized resin was studied by differential scanning calorimetry (DSC) and rheology. Then, the synthesized biobased acid hardener was employed as a novel curing agent for bisphenol A diglycidyl ether to elaborate new partially biobased materials. These materials, formulated in stoichiometry ratio, were characterized by DSC, thermogravimetry analyses, dynamic mechanical analyses and exhibit interesting properties for coatings. Practical applications: The products of the chemistry described in this contribution, i.e., polyacid from soybean oil and thioglycolic acid, provide biobased building blocks for further epoxy resin syntheses by reaction with epoxy groups. The obtained epoxy resins are partially biobased and may be applied as binders and coatings. Fully biobased polyacid was synthesized by thiol‐ene coupling reaction between soybean oil and thioglycolic acid. Synthesized polyacid was formulated with BADGE to yield partially biobased epoxy resins. Reactivity of synthesized polyacid is far higher than other acids due to sulfur presence in vicinity. Thermal properties of obtained materials showed that synthesized polyacid lead to coating material with Tg values around −12°C.
ISSN:1438-7697
1438-9312
DOI:10.1002/ejlt.201200363