Pressureless Silver Sintering Die-Attach for SiC Power Devices

Pressureless silver sintering is an interesting die-attach technique that could overcome the reliability limitations of the power electronic devices caused by their packaging. In this paper, we study the manufacturing parameters that affect the die attach: atmosphere, drying time, heating ramp rate, sintering temperature and duration. It is found that sintering under air gives better results, but causes the substrates to oxidize. Sintering under nitrogen keeps the surfaces oxide-free, at the cost of a weaker attach.