Highly efficient thermal glue for carbon nanotubes based on azide polymers

Equilibrium molecular dynamics (EMD) simulations and experimental data show that the thermal contact resistance (TCR) between carbon nanotube (CNT) and azide-functionalized polymer with C-N bond is significantly decreased compared to that with Van der Waals force interaction. EMD simulations indicate that C-N covalent bond between CNT and polymer is the most efficient way to reduce TCR, and we measured the lowest thermal interface resistance of Si/CNT/Polymer/Cu thermal interface material as 1.40 mm 2 KW −1 with CNTs of 10 μ m length. These results provide useful information for future designs of thermal glue for carbon-based materials with better thermal conduction.