A discrete dislocation dynamics modeling for thermal fatigue of preferred oriented copper via patterns

A numerical modeling, which is hierarchically coupled with the crystal plasticity finite element method and discrete dislocation dynamics, was performed to examine thermal fatigue behavior of via pattern in ultra-large-scale copper interconnections. The pattern had a pillar shape and one of three crystallographic orientations, 〈0 0 1〉, 〈1 1 0〉 and 〈1 1 1〉, along its longitudinal direction. The internal stress and surface morphology on via patterns could be obtained considering the generation of dislocations and their motion. A robust via pattern in terms of crystallographic orientation was suggested.