A different way of performing picosecond ultrasonic measurements in thin transparent films based on laser-wavelength effects

We present a way of using picosecond ultrasonics to simultaneously get the thickness and elastic properties of thin dielectric layers. This is based on the use of a blue probe which is shown to improve the detection of acousto-optic oscillations in the dielectric from which the sound velocity can be...

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Veröffentlicht in:	Applied physics letters 2005-05, Vol.86 (21), p.211903-211903-3
Hauptverfasser:	Devos, A., Côte, R., Caruyer, G., Lefèvre, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Physics
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container_end_page	211903-3
container_issue	21
container_start_page	211903
container_title	Applied physics letters
container_volume	86
creator	Devos, A. Côte, R. Caruyer, G. Lefèvre, A.
description	We present a way of using picosecond ultrasonics to simultaneously get the thickness and elastic properties of thin dielectric layers. This is based on the use of a blue probe which is shown to improve the detection of acousto-optic oscillations in the dielectric from which the sound velocity can be measured from the refractive index. At the same wavelength a strong response of the silicon is used to detect the arrival of the acoustic pulse. We apply this scheme to various materials deposited on silicon substrates.
doi_str_mv	10.1063/1.1929869
format	Article
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language	eng
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source	AIP Journals Complete; AIP Digital Archive
subjects	Physics
title	A different way of performing picosecond ultrasonic measurements in thin transparent films based on laser-wavelength effects
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