A different way of performing picosecond ultrasonic measurements in thin transparent films based on laser-wavelength effects

We present a way of using picosecond ultrasonics to simultaneously get the thickness and elastic properties of thin dielectric layers. This is based on the use of a blue probe which is shown to improve the detection of acousto-optic oscillations in the dielectric from which the sound velocity can be...

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Veröffentlicht in:Applied physics letters 2005-05, Vol.86 (21), p.211903-211903-3
Hauptverfasser: Devos, A., Côte, R., Caruyer, G., Lefèvre, A.
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Sprache:eng
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Zusammenfassung:We present a way of using picosecond ultrasonics to simultaneously get the thickness and elastic properties of thin dielectric layers. This is based on the use of a blue probe which is shown to improve the detection of acousto-optic oscillations in the dielectric from which the sound velocity can be measured from the refractive index. At the same wavelength a strong response of the silicon is used to detect the arrival of the acoustic pulse. We apply this scheme to various materials deposited on silicon substrates.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.1929869