Role of steps in deposition rate in silane chemical vapor deposition on Si(111)
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Veröffentlicht in: | Physical review. B, Condensed matter and materials physics Condensed matter and materials physics, 2005-02, Vol.71 (8), p.085314.1-085314.4, Article 085314 |
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container_end_page | 085314.4 |
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container_issue | 8 |
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container_title | Physical review. B, Condensed matter and materials physics |
container_volume | 71 |
creator | MASSON, L THIBAUDAU, F |
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doi_str_mv | 10.1103/PhysRevB.71.085314 |
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fullrecord | <record><control><sourceid>hal_cross</sourceid><recordid>TN_cdi_hal_primary_oai_HAL_hal_00015224v1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>oai_HAL_hal_00015224v1</sourcerecordid><originalsourceid>FETCH-LOGICAL-c311t-237d942917828f66542da0aa61b08daed9a5f488e499e4abbd13dcfa0753c3483</originalsourceid><addsrcrecordid>eNpNUE1Lw0AQXUTBWv0DnnIR7CF1Zz-SzbEWtUKhUhW8LdNkQ1fSbNgNhf57t8QvGJjh8d7MvEfINdApAOV3L9tDWJv9_TSHKVWSgzghI5CSpozLj9M400KlFBick4sQPikFUQg2Iqu1a0zi6iT0pguJbZPKdC7Y3ro28dibIxRsg61Jyq3Z2RKbZI-d8_-JsV7tLQBMLslZjU0wV999TN4fH97mi3S5enqez5ZpyQH6-FVexfsF5IqpOsukYBVSxAw2VFVoqgJlLZQyoiiMwM2mAl6VNdJc8pILxcdkMuzdYqM7b3foD9qh1YvZUh8xGi1KxsQeIpcN3NK7ELypfwVA9TE-_ROfzkEP8UXRzSDqMETPtce2tOFPmWUqZzTjX84FcEg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Role of steps in deposition rate in silane chemical vapor deposition on Si(111)</title><source>American Physical Society Journals</source><creator>MASSON, L ; THIBAUDAU, F</creator><creatorcontrib>MASSON, L ; THIBAUDAU, F</creatorcontrib><identifier>ISSN: 1098-0121</identifier><identifier>EISSN: 1550-235X</identifier><identifier>DOI: 10.1103/PhysRevB.71.085314</identifier><language>eng</language><publisher>Ridge, NY: American Physical Society</publisher><subject>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) ; Condensed matter: structure, mechanical and thermal properties ; Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Physics ; Solid surfaces and solid-solid interfaces ; Surface structure and topography ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>Physical review. B, Condensed matter and materials physics, 2005-02, Vol.71 (8), p.085314.1-085314.4, Article 085314</ispartof><rights>2005 INIST-CNRS</rights><rights>Distributed under a Creative Commons Attribution 4.0 International License</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c311t-237d942917828f66542da0aa61b08daed9a5f488e499e4abbd13dcfa0753c3483</citedby><cites>FETCH-LOGICAL-c311t-237d942917828f66542da0aa61b08daed9a5f488e499e4abbd13dcfa0753c3483</cites><orcidid>0000-0003-0587-2468 ; 0000-0003-4775-6588</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,780,784,885,2874,2875,27923,27924</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16687206$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://hal.science/hal-00015224$$DView record in HAL$$Hfree_for_read</backlink></links><search><creatorcontrib>MASSON, L</creatorcontrib><creatorcontrib>THIBAUDAU, F</creatorcontrib><title>Role of steps in deposition rate in silane chemical vapor deposition on Si(111)</title><title>Physical review. B, Condensed matter and materials physics</title><subject>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physics</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surface structure and topography</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>1098-0121</issn><issn>1550-235X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNpNUE1Lw0AQXUTBWv0DnnIR7CF1Zz-SzbEWtUKhUhW8LdNkQ1fSbNgNhf57t8QvGJjh8d7MvEfINdApAOV3L9tDWJv9_TSHKVWSgzghI5CSpozLj9M400KlFBick4sQPikFUQg2Iqu1a0zi6iT0pguJbZPKdC7Y3ro28dibIxRsg61Jyq3Z2RKbZI-d8_-JsV7tLQBMLslZjU0wV999TN4fH97mi3S5enqez5ZpyQH6-FVexfsF5IqpOsukYBVSxAw2VFVoqgJlLZQyoiiMwM2mAl6VNdJc8pILxcdkMuzdYqM7b3foD9qh1YvZUh8xGi1KxsQeIpcN3NK7ELypfwVA9TE-_ROfzkEP8UXRzSDqMETPtce2tOFPmWUqZzTjX84FcEg</recordid><startdate>20050201</startdate><enddate>20050201</enddate><creator>MASSON, L</creator><creator>THIBAUDAU, F</creator><general>American Physical Society</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>1XC</scope><orcidid>https://orcid.org/0000-0003-0587-2468</orcidid><orcidid>https://orcid.org/0000-0003-4775-6588</orcidid></search><sort><creationdate>20050201</creationdate><title>Role of steps in deposition rate in silane chemical vapor deposition on Si(111)</title><author>MASSON, L ; THIBAUDAU, F</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c311t-237d942917828f66542da0aa61b08daed9a5f488e499e4abbd13dcfa0753c3483</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physics</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Surface structure and topography</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>MASSON, L</creatorcontrib><creatorcontrib>THIBAUDAU, F</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Hyper Article en Ligne (HAL)</collection><jtitle>Physical review. B, Condensed matter and materials physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>MASSON, L</au><au>THIBAUDAU, F</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Role of steps in deposition rate in silane chemical vapor deposition on Si(111)</atitle><jtitle>Physical review. B, Condensed matter and materials physics</jtitle><date>2005-02-01</date><risdate>2005</risdate><volume>71</volume><issue>8</issue><spage>085314.1</spage><epage>085314.4</epage><pages>085314.1-085314.4</pages><artnum>085314</artnum><issn>1098-0121</issn><eissn>1550-235X</eissn><cop>Ridge, NY</cop><pub>American Physical Society</pub><doi>10.1103/PhysRevB.71.085314</doi><orcidid>https://orcid.org/0000-0003-0587-2468</orcidid><orcidid>https://orcid.org/0000-0003-4775-6588</orcidid></addata></record> |
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source | American Physical Society Journals |
subjects | Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Methods of deposition of films and coatings film growth and epitaxy Physics Solid surfaces and solid-solid interfaces Surface structure and topography Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) |
title | Role of steps in deposition rate in silane chemical vapor deposition on Si(111) |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T14%3A40%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-hal_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Role%20of%20steps%20in%20deposition%20rate%20in%20silane%20chemical%20vapor%20deposition%20on%20Si(111)&rft.jtitle=Physical%20review.%20B,%20Condensed%20matter%20and%20materials%20physics&rft.au=MASSON,%20L&rft.date=2005-02-01&rft.volume=71&rft.issue=8&rft.spage=085314.1&rft.epage=085314.4&rft.pages=085314.1-085314.4&rft.artnum=085314&rft.issn=1098-0121&rft.eissn=1550-235X&rft_id=info:doi/10.1103/PhysRevB.71.085314&rft_dat=%3Chal_cross%3Eoai_HAL_hal_00015224v1%3C/hal_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |