Cu contamination control for advanced interconnect manufacturing
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| Veröffentlicht in: | Solid state technology 2000-05, Vol.43 (5), p.137 |
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| Format: | Magazinearticle |
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| container_issue | 5 |
| container_start_page | 137 |
| container_title | Solid state technology |
| container_volume | 43 |
| creator | Dornisch, Dieter Li, Guangming Brongo, Maureen |
| description | |
| format | Magazinearticle |
| fullrecord | <record><control><sourceid>gale</sourceid><recordid>TN_cdi_gale_infotracmisc_A62451270</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A62451270</galeid><sourcerecordid>A62451270</sourcerecordid><originalsourceid>FETCH-LOGICAL-g255t-4e3078e6e22b9b920cb88580ffd5f5ee70fb4ed1bfa311f530463cd4475d7bcf3</originalsourceid><addsrcrecordid>eNptzE1LxDAQBuAcFFxX_0PxbCGfTfbmUvyCBS8K3pZ8zJRIm0Ca-vst6kFwmcPLO_MwZ2RDqTAtY-z9glzO8welTHBtNuSuXxqfU7VTTLbGnL5byWODuTQ2fNrkITQxVSjrJYGvzWTTgtbXpcQ0XJFztOMM17-5JW8P96_9U3t4eXzu94d24ErVVoKg2kAHnLud23HqnTHKUMSgUAFoik5CYA6tYAyVoLITPkipVdDOo9iSm5-_gx3hGBPmWqyf4uyP-45LxbimK7o9gQZIUOyYE2Bc1395e4KvE2CK_r__AjHzZD4</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>magazinearticle</recordtype></control><display><type>magazinearticle</type><title>Cu contamination control for advanced interconnect manufacturing</title><source>EBSCOhost Business Source Complete</source><creator>Dornisch, Dieter ; Li, Guangming ; Brongo, Maureen</creator><creatorcontrib>Dornisch, Dieter ; Li, Guangming ; Brongo, Maureen</creatorcontrib><identifier>ISSN: 0038-111X</identifier><language>eng</language><publisher>PennWell Publishing Corp</publisher><subject>Product information ; Semiconductor industry</subject><ispartof>Solid state technology, 2000-05, Vol.43 (5), p.137</ispartof><rights>COPYRIGHT 2000 PennWell Publishing Corp.</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>778,782</link.rule.ids></links><search><creatorcontrib>Dornisch, Dieter</creatorcontrib><creatorcontrib>Li, Guangming</creatorcontrib><creatorcontrib>Brongo, Maureen</creatorcontrib><title>Cu contamination control for advanced interconnect manufacturing</title><title>Solid state technology</title><subject>Product information</subject><subject>Semiconductor industry</subject><issn>0038-111X</issn><fulltext>true</fulltext><rsrctype>magazinearticle</rsrctype><creationdate>2000</creationdate><recordtype>magazinearticle</recordtype><sourceid/><recordid>eNptzE1LxDAQBuAcFFxX_0PxbCGfTfbmUvyCBS8K3pZ8zJRIm0Ca-vst6kFwmcPLO_MwZ2RDqTAtY-z9glzO8welTHBtNuSuXxqfU7VTTLbGnL5byWODuTQ2fNrkITQxVSjrJYGvzWTTgtbXpcQ0XJFztOMM17-5JW8P96_9U3t4eXzu94d24ErVVoKg2kAHnLud23HqnTHKUMSgUAFoik5CYA6tYAyVoLITPkipVdDOo9iSm5-_gx3hGBPmWqyf4uyP-45LxbimK7o9gQZIUOyYE2Bc1395e4KvE2CK_r__AjHzZD4</recordid><startdate>20000501</startdate><enddate>20000501</enddate><creator>Dornisch, Dieter</creator><creator>Li, Guangming</creator><creator>Brongo, Maureen</creator><general>PennWell Publishing Corp</general><scope/></search><sort><creationdate>20000501</creationdate><title>Cu contamination control for advanced interconnect manufacturing</title><author>Dornisch, Dieter ; Li, Guangming ; Brongo, Maureen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-g255t-4e3078e6e22b9b920cb88580ffd5f5ee70fb4ed1bfa311f530463cd4475d7bcf3</frbrgroupid><rsrctype>magazinearticle</rsrctype><prefilter>magazinearticle</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Product information</topic><topic>Semiconductor industry</topic><toplevel>online_resources</toplevel><creatorcontrib>Dornisch, Dieter</creatorcontrib><creatorcontrib>Li, Guangming</creatorcontrib><creatorcontrib>Brongo, Maureen</creatorcontrib><jtitle>Solid state technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Dornisch, Dieter</au><au>Li, Guangming</au><au>Brongo, Maureen</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Cu contamination control for advanced interconnect manufacturing</atitle><jtitle>Solid state technology</jtitle><date>2000-05-01</date><risdate>2000</risdate><volume>43</volume><issue>5</issue><spage>137</spage><pages>137-</pages><issn>0038-111X</issn><pub>PennWell Publishing Corp</pub></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0038-111X |
| ispartof | Solid state technology, 2000-05, Vol.43 (5), p.137 |
| issn | 0038-111X |
| language | eng |
| recordid | cdi_gale_infotracmisc_A62451270 |
| source | EBSCOhost Business Source Complete |
| subjects | Product information Semiconductor industry |
| title | Cu contamination control for advanced interconnect manufacturing |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T12%3A29%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Cu%20contamination%20control%20for%20advanced%20interconnect%20manufacturing&rft.jtitle=Solid%20state%20technology&rft.au=Dornisch,%20Dieter&rft.date=2000-05-01&rft.volume=43&rft.issue=5&rft.spage=137&rft.pages=137-&rft.issn=0038-111X&rft_id=info:doi/&rft_dat=%3Cgale%3EA62451270%3C/gale%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_galeid=A62451270&rfr_iscdi=true |