Wirebonding to multilevel metal
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| Veröffentlicht in: | Solid state technology 1997-11, Vol.40 (11), p.87-97 |
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| Hauptverfasser: | , , , , |
| Format: | Magazinearticle |
| Sprache: | eng |
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| container_end_page | 97 |
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| container_issue | 11 |
| container_start_page | 87 |
| container_title | Solid state technology |
| container_volume | 40 |
| creator | O'NEILL, P. M EATON, D. H PHUA, T LOH, F CHIN, B |
| description | |
| format | Magazinearticle |
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| fulltext | fulltext |
| identifier | ISSN: 0038-111X |
| ispartof | Solid state technology, 1997-11, Vol.40 (11), p.87-97 |
| issn | 0038-111X |
| language | eng |
| recordid | cdi_gale_infotracmisc_A20126873 |
| source | Business Source Complete |
| subjects | Analysis Applied sciences Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuit fabrication Metal bonding |
| title | Wirebonding to multilevel metal |
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