Microstructure and Physicomechanical Properties of a Cu-8 at % Pd Alloy

The evolution of the structure, microhardness, and electrical resistivity has been studied during prolonged low-temperature annealings of the Cu-8 at % Pd alloy. An increase in the microhardness and electrical resistivity after annealings at temperatures of 250 and 300°C has been revealed; the preliminary deformation significantly accelerates and enhances this effect; and the X-ray diffraction patterns remain unchanged and correspond to an fcc solid solution. Using transmission electron microscopy, the state of an atomic short-range order has been detected in the quenched alloy; prolonged annealings of the deformed alloy lead to the formation of microregions of the ordered L 1 2 phase.