Structural studies of ZnS:Cu nanocomposites in porous [Al.sub.2][O.sub.3] of different thicknesses

We present EXAFS, XANES, and X-ray diffraction data on nanoscale ZnS:Cu (5 at %) structures fabricated by the thermal deposition of a ZnS and Cu powder mixture in porous anodic alumina matrices with a pore diameter of 80 nm and thicknesses of 1, 3, and 5 [micro]m. The results obtained are compared w...

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Veröffentlicht in:Semiconductors (Woodbury, N.Y.) N.Y.), 2017-02, Vol.51 (2), p.207
Hauptverfasser: Valeev, R.G, Trigub, A.L, Chukavin, A.I, Beltiukov, A.N
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Sprache:eng
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Zusammenfassung:We present EXAFS, XANES, and X-ray diffraction data on nanoscale ZnS:Cu (5 at %) structures fabricated by the thermal deposition of a ZnS and Cu powder mixture in porous anodic alumina matrices with a pore diameter of 80 nm and thicknesses of 1, 3, and 5 [micro]m. The results obtained are compared with data on ZnS:Cu films deposited onto a polycor surface. According to X-ray diffraction data, the samples contain copper and zinc compounds with sulfur ([Cu.sub.2]S and ZnS, respectively); the ZnS compound is in the cubic (sphalerite) and hexagonal (wurtzite) modifications. EXAFS and XANES studies at the K absorption edges of zinc and copper showed that, in samples deposited onto polycor and alumina with thicknesses of 3 and 5 [micro]m, most copper atoms form the [Cu.sub.2]S compound, while, in the sample deposited onto a 1-[micro]m-thick alumina layer, copper atoms form metallic particles on the sample surface. Copper crystals affect the Zn-S interatomic distance in the sample with a 1-[micro]m-thick porous [Al.sub.2][O.sub.3] layer; this distance is smaller than in the other samples. DOI: 10.1134/S1063782617020221
ISSN:1063-7826
DOI:10.1134/S1063782617020221