Defect-related luminescence in silicon [p.sup.+]--n junctions

Ultra-shallow [p.sup.+]-n junctions fabricated by the silicon planar technology based on the short-time nonequilibrium diffusion of boron from the gas phase into n-Si (100) substrates upon their preliminary oxidation and the opening of windows in SiO2 by electron lithography and reactive ion etching...

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Veröffentlicht in:Semiconductors (Woodbury, N.Y.) N.Y.), 2015-09, p.1222
Hauptverfasser: Kuzmin, R.V, Bagraev, N.T, Klyachkin, L.E, Malyarenko, A.M
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Klyachkin, L.E
Malyarenko, A.M
description Ultra-shallow [p.sup.+]-n junctions fabricated by the silicon planar technology based on the short-time nonequilibrium diffusion of boron from the gas phase into n-Si (100) substrates upon their preliminary oxidation and the opening of windows in SiO2 by electron lithography and reactive ion etching are examined. The electro- and photoluminescence spectra measured in the study demonstrate emission in the range 1-1.6 µm, which is indicative of the presence of a high concentration of defects that probably appear as a result of the amorphizing effect of ions in the etching stage. DOI: 10.1134/S1063782615090171
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subjects Electronics industry
Integrated circuit fabrication
Light-emitting diodes
Photoluminescence
Silicon
title Defect-related luminescence in silicon [p.sup.+]--n junctions
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